"Report on power, thermal and reliability prediction for 3D Networks-on-Chip."

Khanh N. Dang et al. (2020)

> Home

Details and statistics

DOI: —

access: open

type: Informal or Other Publication

metadata version: 2020-03-24

- view
  - electronic edition @ arxiv.org (open access)
- export record
  dblp key:
  - journals/corr/abs-2003-08648
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2003-08648
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR abs/2003.08648 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.