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"Numerical analysis of a contact problem with wear."

Danfu Han et al. (2020)

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DOI: 10.1016/J.CAMWA.2019.12.027

access: closed

type: Journal Article

metadata version: 2020-05-22

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  - journals/cma/HanHJO20
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  - https://dblp.org/rec/journals/cma/HanHJO20
Danfu Han, Weimin Han, Michal Jureczka, Anna Ochal:
Numerical analysis of a contact problem with wear. Comput. Math. Appl. 79(10): 2942-2951 (2020)

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