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"Modeling of skin thermal pain: A preliminary study."

Feng Xu et al. (2008)

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DOI: 10.1016/J.AMC.2008.05.045

access: closed

type: Journal Article

metadata version: 2020-02-21

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  - journals/amc/XuWSL08
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  - https://dblp.org/rec/journals/amc/XuWSL08
Feng Xu, Ting Wen, Keith A. Seffen, Tianjian Lu:
Modeling of skin thermal pain: A preliminary study. Appl. Math. Comput. 205(1): 37-46 (2008)

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