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"SolderNet: Towards trustworthy visual inspection of solder joints in ..."

Hayden Gunraj et al. (2023)

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DOI: 10.1002/AAAI.12129

access: open

type: Journal Article

metadata version: 2024-01-26

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Hayden Gunraj, Paul Guerrier, Sheldon Fernandez, Alexander Wong:
SolderNet: Towards trustworthy visual inspection of solder joints in electronics manufacturing using explainable artificial intelligence. AI Mag. 44(4): 442-452 (2023)

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