"Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow ..."

Fulong Zhu et al. (2018)

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DOI: 10.1109/ACCESS.2018.2842199

access: open

type: Journal Article

metadata version: 2023-11-21

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Fulong Zhu, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu:
Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique. IEEE Access 6: 33099-33110 (2018)

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