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"Electro-Thermal-Mechanical Multiphysics Coupling Failure Analysis Based on ..."

Jianbo Zhou et al. (2019)

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DOI: 10.1109/ACCESS.2019.2956186

access: open

type: Journal Article

metadata version: 2020-09-08

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  dblp key:
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  - https://dblp.org/rec/journals/access/ZhouLHYLN19
Jianbo Zhou, Bing Li, Yigang He, Weibo Yuan, Jiacheng Liu, Huadong Ni:
Electro-Thermal-Mechanical Multiphysics Coupling Failure Analysis Based on Improved IGBT Dynamic Model. IEEE Access 7: 174155-174166 (2019)

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