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"DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder ..."

Muhammad Waqar et al. (2021)

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DOI: 10.1109/ACCESS.2021.3074595

access: open

type: Journal Article

metadata version: 2021-05-16

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  - journals/access/WaqarBKB21
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  - https://dblp.org/rec/journals/access/WaqarBKB21
Muhammad Waqar, GeunYong Bak, Junhyeong Kwon, Sanghyeon Baeg:
DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package. IEEE Access 9: 63002-63011 (2021)

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