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"3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems."

Sang-Hee Shin et al. (2022)

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DOI: 10.1109/ACCESS.2022.3167437

access: open

type: Journal Article

metadata version: 2023-09-30

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  dblp key:
  - journals/access/ShinPZSSRL22
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  - https://dblp.org/rec/journals/access/ShinPZSSRL22
Sang-Hee Shin, Roshan Payapulli, Liyan Zhu, Manoj Stanley, Xiaobang Shang, Nick M. Ridler, Stepan Lucyszyn:
3-D Printed Plug and Play Prototyping for Low-Cost Sub-THz Subsystems. IEEE Access 10: 41708-41719 (2022)

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