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"Investigation on the Effects of Interconnect RC in 3nm Technology Node ..."

Yeji Lee et al. (2022)

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DOI: 10.1109/ACCESS.2022.3195506

access: open

type: Journal Article

metadata version: 2022-08-25

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  - https://dblp.org/rec/journals/access/LeeJKPYCJ22
Yeji Lee, Wonyeong Jang, Kyungbae Kwon, Jihun Park, Changhyun Yoo, Jeesoo Chang, Jongwook Jeon:
Investigation on the Effects of Interconnect RC in 3nm Technology Node Using Path-Finding Process Design Kit. IEEE Access 10: 80695-80702 (2022)

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