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"A Health Indicator for Interconnect structure of QFP Package Under ..."
Jiaxing Hu et al. (2020)
- Jiaxing Hu
, Bo Jing, Yifeng Huang, Xiaoxuan Jiao, Meng Sun, Longteng Li:
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature. IEEE Access 8: 122898-122907 (2020)
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