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"Power Semiconductor Devices and Packages: Solder Mechanical ..."
Michele Calabretta et al. (2021)
- Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia:
Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction. IEEE Access 9: 22859-22867 (2021)
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