"A Survey of Detection Methods for Die Attachment and Wire Bonding Defects ..."

Lamia Alam, Nasser Kehtarnavaz (2022)

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DOI: 10.1109/ACCESS.2022.3197624

access: open

type: Journal Article

metadata version: 2022-09-26

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Lamia Alam, Nasser Kehtarnavaz:
A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing. IEEE Access 10: 83826-83840 (2022)

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