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"A Holistic Analysis of Circuit Performance Variations in 3-D ICs With ..."

Sravan K. Marella, Sachin S. Sapatnekar (2015)

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DOI: 10.1109/TVLSI.2014.2335154

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/MarellaS15
Sravan K. Marella, Sachin S. Sapatnekar:
A Holistic Analysis of Circuit Performance Variations in 3-D ICs With Thermal and TSV-Induced Stress Considerations. IEEE Trans. Very Large Scale Integr. Syst. 23(7): 1308-1321 (2015)

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