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"The impact of intra-die device parameter variations on path delays and on ..."

M. Eisele et al. (1997)

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DOI: 10.1109/92.645062

access: closed

type: Journal Article

metadata version: 2020-03-11

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M. Eisele, Jörg Berthold, Doris Schmitt-Landsiedel, R. Mahnkopf:
The impact of intra-die device parameter variations on path delays and on the design for yield of low voltage digital circuits. IEEE Trans. Very Large Scale Integr. Syst. 5(4): 360-368 (1997)

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