"Parametric Fault Testing and Performance Characterization of Post-Bond ..."

Li-Ren Huang et al. (2014)

> Home

Details and statistics

DOI: 10.1109/TCAD.2013.2290589

access: closed

type: Journal Article

metadata version: 2020-09-24

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tcad/HuangHTC14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tcad/HuangHTC14
Li-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng:
Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(3): 476-488 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.