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"Modeling of multiconductor systems for packaging and interconnecting ..."

Thomas F. Hayes, John J. Barrett (1992)

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DOI: 10.1109/43.125090

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/HayesB92
Thomas F. Hayes, John J. Barrett:
Modeling of multiconductor systems for packaging and interconnecting high-speed digital IC's. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 11(4): 424-431 (1992)

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