"Force and collapsed shape of a liquid solder bump under load."

N. van Veen, W. Luiten (2017)

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DOI: 10.1016/J.MICROREL.2017.05.040

access: closed

type: Journal Article

metadata version: 2020-02-22

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N. van Veen, W. Luiten:
Force and collapsed shape of a liquid solder bump under load. Microelectron. Reliab. 79: 547-553 (2017)

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