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"A quantitative method of reliability estimation for surface mount solder ..."

Bo Tao et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.04.013

access: closed

type: Journal Article

metadata version: 2022-10-21

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Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong:
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q_eta. Microelectron. Reliab. 46(5-6): 864-872 (2006)

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