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"A novel decapsulation technique for failure analysis of epoxy molded IC ..."

Chien-Pan Liu et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.11.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chien-Pan Liu, Yen-Fu Liu, Chang-Hung Li, Hung-Chieh Cheng, Yi-Chun Kung, Jeng-Yu Lin:
A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds. Microelectron. Reliab. 52(4): 725-734 (2012)

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