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"Impact of the number of chips on the reliability of the solder balls for ..."

Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang (2006)

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DOI: 10.1016/J.MICROREL.2005.06.011

access: closed

type: Journal Article

metadata version: 2022-10-02

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Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang:
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. Microelectron. Reliab. 46(2-4): 386-399 (2006)

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