Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Reliability aspects of copper metallization and interconnect technology ..."

Frank Hille et al. (2016)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2016.07.119

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/HilleRSSHBGCRUK16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/HilleRSSHBGCRUK16
Frank Hille, Roman Roth, Carsten Schäffer, Holger Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, Alexander Ciliox, Karina Rott, Frank Umbach, Martin Kerber:
Reliability aspects of copper metallization and interconnect technology for power devices. Microelectron. Reliab. 64: 393-402 (2016)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.