"Computer Simulation Of Flip-Chip Underfill Encapsulation Process Using ..."

M. B. Liu, G. R. Liu, K. Y. Lam (2003)

Details and statistics

DOI: 10.1142/S1465876303001381

access: closed

type: Journal Article

metadata version: 2020-07-09

a service of  Schloss Dagstuhl - Leibniz Center for Informatics