"Thermal Deformation Suppression Chip Based on Material Symmetry Design for ..."

Bowen Xing et al. (2020)

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DOI: 10.1109/ACCESS.2020.2977135

access: open

type: Journal Article

metadata version: 2024-07-25

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Bowen Xing, Bin Zhou, Xinxi Zhang, Wenming Zhang, Bo Hou, Qi Wei, Tian Zhang, Rong Zhang:
Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices. IEEE Access 8: 43314-43324 (2020)

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