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"Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of ..."

TingYen Chiang, Kaustav Banerjee, Krishna Saraswat (2001)

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DOI: 10.1109/ICCAD.2001.968613

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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TingYen Chiang, Kaustav Banerjee, Krishna Saraswat:
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects. ICCAD 2001: 165-

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