Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs."

Arjun Chaudhuri et al. (2019)

> Home

Details and statistics

DOI: 10.1109/ETS.2019.8791515

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ets/ChaudhuriBPKCL19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ets/ChaudhuriBPKCL19
Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS 2019: 1-6

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.