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ORCID"Stress-aware P/G TSV planning in 3D-ICs."
Shengcheng Wang et al. (2015)
- Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori:
Stress-aware P/G TSV planning in 3D-ICs. ASP-DAC 2015: 94-99
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