"Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC ..."

Paul Enquist et al. (2009)

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DOI: 10.1109/3DIC.2009.5306533

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Paul Enquist, G. Fountain, C. Petteway, A. Hollingsworth, H. Grady:
Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications. 3DIC 2009: 1-6

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