"Operator Resource modelling in a Multiple wafer Sizes fabrication ..."

Georg Seidel et al. (2018)

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DOI: 10.1109/WSC.2018.8632398

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Georg Seidel, Patrick Preuss, André Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan:
Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. WSC 2018: 3651-3659

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