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"TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test."

Kangkang Xu, Yang Yu, Xiyuan Peng (2021)

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DOI: 10.1109/VTS50974.2021.9441058

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  dblp key:
  - conf/vts/XuYP21
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Kangkang Xu, Yang Yu, Xiyuan Peng:
TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test. VTS 2021: 1-6

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