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"A structured and scalable test access architecture for TSV-based 3D ..."

Erik Jan Marinissen, Jouke Verbree, Mario Konijnenburg (2010)

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DOI: 10.1109/VTS.2010.5469556

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Erik Jan Marinissen, Jouke Verbree, Mario Konijnenburg:
A structured and scalable test access architecture for TSV-based 3D stacked ICs. VTS 2010: 269-274

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