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"300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling."

Kirby Maxey et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830457

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-28

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  - conf/vlsit/MaxeyNOPOMDRHTA22
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  - https://dblp.org/rec/conf/vlsit/MaxeyNOPOMDRHTA22
Kirby Maxey, C. H. Naylor, K. P. O'Brien, A. Penumatcha, Adedapo Oni, C. Mokhtarzadeh, C. J. Dorow, C. Rogan, B. Holybee, T. Tronic, D. Adams, N. Arefin, A. Sen Gupta, C.-C. Lin, T. Zhong, S. Lee, A. Kitamura, R. Bristol, S. B. Clendenning, U. Avci, M. Metz:
300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling. VLSI Technology and Circuits 2022: 419-420

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