"Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of ..."

Ming-Yang Li et al. (2022)

> Home

Details and statistics

DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830376

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/vlsit/LiHSCLCYCHCWLWL22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/vlsit/LiHSCLCYCHCWLWL22
Ming-Yang Li, Ching-Hao Hsu, Shin-Wei Shen, Ang-Sheng Chou, Yuxuan Cosmi Lin, Chih-Piao Chuu, Ning Yang, Sui-An Chou, Lin-Yun Huang, Chao-Ching Cheng, Wei-Yen Woon, Szuya Liao, Chih-I Wu, Lain-Jong Li, Iuliana P. Radu, H.-S. Philip Wong, Han Wang:
Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of High-Performance Monolayer CVD WS2 Transistor. VLSI Technology and Circuits 2022: 290-291

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.