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"Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW ..."

Norio Chujo et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185277

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-28

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Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba:
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. VLSI Technology and Circuits 2023: 1-2

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