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"Impact of Material Interface Geometry on Interconnect Resistance."

Lee Brogan, Jon Reid (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830209

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-04

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  - conf/vlsit/BroganR22
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Lee Brogan, Jon Reid:
Impact of Material Interface Geometry on Interconnect Resistance. VLSI Technology and Circuits 2022: 425-426

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