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"Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE."

Takafumi Fukushima (2021)

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DOI: 10.23919/VLSICIRCUITS52068.2021.9492335

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-02

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  dblp key:
  - conf/vlsic/Fukushima21
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  - https://dblp.org/rec/conf/vlsic/Fukushima21
Takafumi Fukushima:
Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE. VLSI Circuits 2021: 1-2

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