"Enabling inter-die co-optimization in 3-D IC with TSVs."

Chang-Tzu Lin et al. (2013)

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DOI: 10.1109/VLDI-DAT.2013.6533885

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Chang-Tzu Lin, Tsu-Wei Tseng, Yung-Fa Chou, Chia-Hsin Lee, Ding-Ming Kwai:
Enabling inter-die co-optimization in 3-D IC with TSVs. VLSI-DAT 2013: 1-4

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