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"COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic ..."

Siva Nishok Dhanuskodi, Xiang Li, Daniel E. Holcomb (2020)

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DOI: —

access: open

type: Conference or Workshop Paper

metadata version: 2021-01-29

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  - electronic edition @ usenix.org (open access)
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  dblp key:
  - conf/uss/DhanuskodiLH20
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  persistent URL:
  - https://dblp.org/rec/conf/uss/DhanuskodiLH20
Siva Nishok Dhanuskodi, Xiang Li, Daniel E. Holcomb:
COUNTERFOIL: Verifying Provenance of Integrated Circuits using Intrinsic Package Fingerprints and Inexpensive Cameras. USENIX Security Symposium 2020: 1255-1272

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