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ORCID"Through-silicon-via aware interconnect prediction and optimization for 3D ..."
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim (2009)
- Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
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Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. SLIP 2009: 85-92
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