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"Vertical pitch limitations on performance enhancement in bonded ..."

James W. Joyner et al. (2000)

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DOI: 10.1145/333032.333042

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  dblp key:
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James W. Joyner, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl:
Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures. SLIP 2000: 123-127

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