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"A Power-Efficient and High-Throughput Hardware Design for 3D-HEVC ..."

Murilo R. Perleberg et al. (2018)

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DOI: 10.1109/SBCCI.2018.8533257

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/sbcci/PerlebergACSAZP18
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  - https://dblp.org/rec/conf/sbcci/PerlebergACSAZP18
Murilo R. Perleberg, Vladimir Afonso, Ruhan A. Conceição, Altamiro Amadeu Susin, Luciano Volcan Agostini, Bruno Zatt, Marcelo Schiavon Porto:
A Power-Efficient and High-Throughput Hardware Design for 3D-HEVC Disparity Estimation. SBCCI 2018: 1-6

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