"Lumped Element High Precision X-Band Bandpass Filter with Through Silicon ..."

Ki R. Shin, Kim Eilert (2021)

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DOI: 10.1109/RWS50353.2021.9360374

access: closed

type: Conference or Workshop Paper

metadata version: 2021-03-03

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Ki R. Shin, Kim Eilert:
Lumped Element High Precision X-Band Bandpass Filter with Through Silicon Via (TSV) Integrated Passive Device (IPD) Technology. RWS 2021: 147-150

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