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"Thermal Simulation Analysis of Carrier Module Electronic Components ..."

Jiyou Peng et al. (2020)

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DOI: 10.1145/3438872.3439122

access: closed

type: Conference or Workshop Paper

metadata version: 2022-06-03

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  dblp key:
  - conf/ricai/PengHHLZWZLD20
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  - https://dblp.org/rec/conf/ricai/PengHHLZWZLD20
Jiyou Peng, Lubin Hang, Xiaobo Huang, Sulong Li, Pengcheng Zhang, Borui Wu, Chuanlei Zhong, Boren Li, Bosong Ding:
Thermal Simulation Analysis of Carrier Module Electronic Components Applied in Downhole Safety Valve Control System. RICAI 2020: 445-449

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