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"3D-IC signal TSV assignment for thermal and wirelength optimization."

Yuxin Qian, Cong Hao, Takeshi Yoshimura (2017)

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DOI: 10.1109/PATMOS.2017.8106948

access: closed

type: Conference or Workshop Paper

metadata version: 2017-11-23

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  dblp key:
  - conf/patmos/QianHY17
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  - https://dblp.org/rec/conf/patmos/QianHY17
Yuxin Qian, Cong Hao, Takeshi Yoshimura:
3D-IC signal TSV assignment for thermal and wirelength optimization. PATMOS 2017: 1-8

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