"A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver ..."

Anirban Samanta et al. (2023)

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DOI: 10.23919/OFC49934.2023.10116163

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-01

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Anirban Samanta, Po-Hsuan Chang, Peng Yan, Mingye Fu, Mehmet Berkay On, Ankur Kumar, Hyungryul Kang, Il-Min Yi, Dedeepya Annabattuni, Yu Zhang, David Scott, Robert Patti, Yang-Hang Fan, Yuanming Zhu, Samuel Palermo, S. J. Ben Yoo:
A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit. OFC 2023: 1-3

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