"A LTCC microsystem vacuum package substrate with embedded cooling ..."

Min Miao et al. (2010)

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DOI: 10.1109/NEMS.2010.5592416

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan:
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. NEMS 2010: 399-403

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