"A 3D micro-channel cooling system embedded in LTCC packaging substrate."

Songtao Jia et al. (2012)

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DOI: 10.1109/NEMS.2012.6196859

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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  - https://dblp.org/rec/conf/nems/JiaMFGHJ12
Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin:
A 3D micro-channel cooling system embedded in LTCC packaging substrate. NEMS 2012: 649-652

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