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"Research on the Cooling System for the System-on-Wafer Packaging."

Rong Cao et al. (2023)

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DOI: 10.1109/NEMS57332.2023.10190863

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-14

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  dblp key:
  - conf/nems/CaoLLWWLD23
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  persistent URL:
  - https://dblp.org/rec/conf/nems/CaoLLWWLD23
Rong Cao, Guandong Liu, Jie Li, Weihao Wang, Chuanzhi Wang, Lingling Liu, Yuanxing Duan:
Research on the Cooling System for the System-on-Wafer Packaging. NEMS 2023: 33-36

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