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"Thermal-Aware Floorplanner for Multi-core 3D ICs with Interlayer Cooling."

Wei Guo et al. (2015)

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DOI: 10.1007/978-3-662-49283-3_3

access: closed

type: Conference or Workshop Paper

metadata version: 2018-07-16

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  dblp key:
  - conf/nccet/GuoZLYZ15
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  - https://dblp.org/rec/conf/nccet/GuoZLYZ15
Wei Guo, Minxuan Zhang, Peng Li, Chaoyun Yao, Hongwei Zhou:
Thermal-Aware Floorplanner for Multi-core 3D ICs with Interlayer Cooling. NCCET 2015: 23-30

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