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"Testing 3D stacked ICs for post-bond partial/complete stack."

Surajit Kumar Roy et al. (2012)

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DOI: 10.1109/MWSCAS.2012.6292072

access: closed

type: Conference or Workshop Paper

metadata version: 2020-06-15

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  dblp key:
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Surajit Kumar Roy, Dona Roy, Chandan Giri, Hafizur Rahman:
Testing 3D stacked ICs for post-bond partial/complete stack. MWSCAS 2012: 522-525

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