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"Reputation and Incentive Mechanism for SDN Applications."

Yufu Wang et al. (2018)

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DOI: 10.1109/MSN.2018.000-3

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-17

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  dblp key:
  - conf/msn/WangLHZ018
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  - https://dblp.org/rec/conf/msn/WangLHZ018
Yufu Wang, Yuan Liu, Jinqiao Hu, Mingwei Zhang, Xingwei Wang:
Reputation and Incentive Mechanism for SDN Applications. MSN 2018: 152-157

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